一、綜合辭彙
1、印製電路：printedcircuit
2、印製線路：printedwiring
3、印製板：printedboard
4、印製板電路：printedcircuitboard(PCB)
5、印製線路板：printedwiringboard(PwB)
6、印製元件：printedcomponent
7、印製接點：printedcontact
8、印製板裝配：printedboardassembly
9、板：board
10、單面印製板：single-sidedprintedboard(SSB)
11、雙面印製板：double-sidedprintedboard(DSB)
12、多層印製板：mulitlayerprintedboard(MLB)
13、多層印製電路板：mulitlayerprintedcircuitboard
14、多層印製線路板：mulitlayerpritedwiringboard
15、剛性印製板：rigidprintedboard
16、剛性單面印製板：rigidsingle-sidedprintedborad
17、剛性雙面印製板：rigiddouble-sidedprintedborad
18、剛性多層印製板：rigidmultilayerprintedboard
19、撓性多層印製板：flexiblemultilayerprintedboard
20、撓性印製板：flexibleprintedboard
21、撓性單面印製板：flexiblesingle-sidedprintedboard
22、撓性雙面印製板：flexibledouble-sidedprintedboard
23、撓性印製電路：flexibleprintedcircuit(FPC)
24、撓性印製線路：flexibleprintedwiring
25、剛性印製板：flex-rigidprintedboard,rigid-flexprintedboard
26、剛性雙面印製板：flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted
27、剛性多層印製板：flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard
28、齊平印製板：flushprintedboard
29、金屬芯印製板：metalcoreprintedboard
30、金屬基印製板：metalbaseprintedboard
31、多重布線印製板：mulit-wiringprintedboard
32、陶瓷印製板：ceramicsubstrateprintedboard
33、導電膠印製板：electroconductivepasteprintedboard
34、模塑電路板：moldedcircuitboard
35、模壓印製板：stampedprintedwiringboard
36、順序層壓多層印製板：sequentially-laminatedmulitlayer
37、散線印製板：discretewiringboard
38、微線印製板：microwireboard
39、積層印製板：buile-upprintedboard
40、積層多層印製板：build-upmulitlayerprintedboard(BUM)
41、積層撓印製板：build-upflexibleprintedboard
42、表面層合電路板：surfacelaminarcircuit(SLC)
43、埋入凸塊連印製板：B2itprintedboard
44、多層膜基板：multi-layeredfilmsubstrate(MFS)
45、層間全內導通多層印製板：ALIVHmultilayerprintedboard
46、載晶片板：chiponboard(COB)
47、埋電阻板：buriedresistanceboard
48、母板：motherboard
49、子板：daughterboard
50、背板：backplane
51、裸板：bareboard
52、鍵盤板夾心板：copper-Invar-copperboard
53、動態撓性板：dynamicflexboard
54、靜態撓性板：staticflexboard
55、可斷拼板：break-awayplanel
56、電纜：cable
57、撓性扁平電纜：flexibleflatcable(FFC)
58、薄膜開關：membraneswitch
59、混合電路：hybridcircuit
60、厚膜：thickfilm
61、厚膜電路：thickfilmcircuit
62、薄膜：thinfilm
63、薄膜混合電路：thinfilmhybridcircuit
64、互連：interconnection
65、導線：conductortraceline
66、齊平導線：flushconductor
67、傳輸線：transmissionline
68、跨交：crossover
69、板邊插頭：edge-boardcontact
70、增強板：stiffener
71、基底：substrate
72、基板面：realestate
73、導線面：conductorside
74、元件面：componentside
75、焊接面：solderside
76、印製：printing
77、格線：grid
78、圖形：pattern
79、導電圖形：conductivepattern
80、非導電圖形：non-conductivepattern
81、字元：legend
82、標誌：mark
二、基材：
1、基材：basematerial
2、層壓板：laminate
3、覆金屬箔基材：metal-cladbadematerial
4、覆銅箔層壓板：copper-cladlaminate(CCL)
5、單面覆銅箔層壓板：single-sidedcopper-cladlaminate
6、雙面覆銅箔層壓板：double-sidedcopper-cladlaminate
7、複合層壓板：compositelaminate
8、薄層壓板：thinlaminate
9、金屬芯覆銅箔層壓板：metalcorecopper-cladlaminate
10、金屬基覆銅層壓板：metalbasecopper-cladlaminate
11、撓性覆銅箔絕緣薄膜：flexiblecopper-claddielectricfilm
12、基體材料：basismaterial
13、預浸材料：prepreg
14、粘結片：bondingsheet
15、預浸粘結片：preimpregnatedbondingsheer
16、環氧玻璃基板：epoxyglasssubstrate
17、加成法用層壓板：laminateforadditiveprocess
18、預製內層覆箔板：masslaminationpanel
19、內層芯板：corematerial
20、催化板材：catalyzedboard,coatedcatalyzedlaminate
21、塗膠催化層壓板：adhesive-coatedcatalyzedlaminate
22、塗膠無催層壓板：adhesive-coateduncatalyzedlaminate
23、粘結層：bondinglayer
24、粘結膜：filmadhesive
25、塗膠粘劑絕緣薄膜：adhesivecoateddielectricfilm
26、無支撐膠粘劑膜：unsupportedadhesivefilm
27、覆蓋層：coverlayer(coverlay)
28、增強板材：stiffenermaterial
29、銅箔面：copper-cladsurface
30、去銅箔面：foilremovalsurface
31、層壓板面：uncladlaminatesurface
32、基膜面：basefilmsurface
33、膠粘劑面：adhesivefaec
34、原始光潔面：platefinish
35、粗面：mattfinish
36、縱向：lengthwisedirection
37、模向：crosswisedirection
38、剪下板：cuttosizepanel
39、酚醛紙質覆銅箔板：phenoliccellulosepapercopper-cladlaminates(phenolic/paperCCL)
40、環氧紙質覆銅箔板：epoxidecellulosepapercopper-cladlaminates(epoxy/paperCCL)
41、環氧玻璃布基覆銅箔板：epoxidewovenglassfabriccopper-cladlaminates
42、環氧玻璃布紙複合覆銅箔板：epoxidecellulosepapercore,glassclothsurfacescopper-cladlaminates
43、環氧玻璃布玻璃纖維複合覆銅箔板：epoxidenonwoven/wovenglassreinforcedcopper-cladlaminates
44、聚酯玻璃布覆銅箔板：ployesterwovenglassfabriccopper-cladlaminates
45、聚醯亞胺玻璃布覆銅箔板：polyimidewovenglassfabriccopper-cladlaminates
46、雙馬來醯亞胺三嗪環氧玻璃布覆銅箔板：bismaleimide/triazine/epoxidewovenglassfabriccopper-cladlamimates
47、環氧合成纖維布覆銅箔板：epoxidesyntheticfiberfabriccopper-cladlaminates
48、聚四乙烯玻璃纖維覆銅箔板：teflon/fiberglasscopper-cladlaminates
49、超薄型層壓板：ultrathinlaminate
50、陶瓷基覆銅箔板：ceramicsbasecopper-cladlaminates
51、紫外線阻擋型覆銅箔板：UVblockingcopper-cladlaminates
三、基材的材料
1、A階樹脂：A-stageresin
2、B階樹脂：B-stageresin
3、C階樹脂：C-stageresin
4、環氧樹脂：epoxyresin
5、酚醛樹脂：phenolicresin
6、聚酯樹脂：polyesterresin
7、聚醯亞胺樹脂：polyimideresin
8、雙馬來醯亞胺三嗪樹脂：bismaleimide-triazineresin
9、丙烯酸樹脂：acrylicresin
10、三聚氰胺甲醛樹脂：melamineformaldehyderesin
11、多官能環氧樹脂：polyfunctionalepoxyresin
12、溴化環氧樹脂：brominatedepoxyresin
13、環氧酚醛：epoxynovolac
14、氟樹脂：fluroresin
15、矽樹脂：siliconeresin
16、矽烷：silane
17、聚合物：polymer
18、無定形聚合物：amorphouspolymer
19、結晶現象：crystallinepolamer
20、雙晶現象：dimorphism
21、共聚物：copolymer
22、合成樹脂：synthetic
23、熱固性樹脂：thermosettingresin
24、熱塑性樹脂：thermoplasticresin
25、感光性樹脂：photosensitiveresin
26、環氧當量：weightperepoxyequivalent(WPE)
27、環氧值：epoxyvalue
28、雙氰胺：dicyandiamide
29、粘結劑：binder
30、膠粘劑：adesive
31、固化劑：curingagent
32、阻燃劑：flameretardant
33、遮光劑：opaquer
34、增塑劑：plasticizers
35、不飽和聚酯：unsatuiatedpolyester
36、聚酯薄膜：polyester
37、聚醯亞胺薄膜：polyimidefilm(PI)
38、聚四氟乙烯：polytetrafluoetylene(PTFE)
39、聚全氟乙烯丙烯薄膜：perfluorinatedethylene-propylenecopolymerfilm(FEP)
40、增強材料：reinforcingmaterial
41、玻璃纖維：glassfiber
42、E玻璃纖維：E-glassfibre
43、D玻璃纖維：D-glassfibre
44、S玻璃纖維：S-glassfibre
45、玻璃布：glassfabric
46、非織布：non-wovenfabric
47、玻璃纖維墊：glassmats
48、紗線：yarn
49、單絲：filament
50、絞股：strand
51、緯紗：weftyarn
52、經紗：warpyarn
53、但尼爾：denier
54、經向：warp-wise
55、緯向：weft-wise,filling-wise
56、織物經緯密度：threadcount
57、織物組織：weavestructure
58、平紋組織：plainstructure
59、壞布：greyfabric
60、稀鬆織物：wovenscrim
61、弓緯：bowofweave
62、斷經：endmissing
63、缺緯：mis-picks
64、緯斜：bias
65、摺痕：crease
66、雲織：waviness
67、魚眼：fisheye
68、毛圈長：featherlength
69、厚薄段：mark
70、裂縫：split
71、捻度：twistofyarn
72、浸潤劑含量：sizecontent
73、浸潤劑殘留量：sizeresidue
74、處理劑含量：finishlevel
75、浸潤劑：size
76、偶聯劑：couplintagent
77、處理織物：finishedfabric
78、聚醯胺纖維：polyarmidefiber
79、聚酯纖維非織布：non-wovenpolyesterfabric
80、浸漬絕緣縱紙：impregnatinginsulationpaper
81、聚芳醯胺纖維紙：aromaticpolyamidepaper
82、斷裂長：breakinglength
83、吸水高度：heightofcapillaryrise
84、濕強度保留率：wetstrengthretention
85、白度：whitenness
86、陶瓷：ceramics
87、導電箔：conductivefoil
88、銅箔：copperfoil
89、電解銅箔：electrodepositedcopperfoil(EDcopperfoil)
90、壓延銅箔：rolledcopperfoil
91、退火銅箔：annealedcopperfoil
92、壓延退火銅箔：rolledannealedcopperfoil(RAcopperfoil)
93、薄銅箔：thincopperfoil
94、塗膠銅箔：adhesivecoatedfoil
95、塗膠脂銅箔：resincoatedcopperfoil(RCC)
96、複合金屬箔：compositemetallicmaterial
97、載體箔：carrierfoil
98、殷瓦：invar
99、箔（剖面）輪廓：foilprofile
100、光面：shinyside
101、粗糙面：matteside
102、處理面：treatedside
103、防鏽處理：stainproofing
104、雙面處理銅箔：doubletreatedfoil
四、設計
1、原理圖：shematicdiagram
2、邏輯圖：logicdiagram
3、印製線路布設：printedwirelayout
4、布設總圖：masterdrawing
5、可製造性設計：design-for-manufacturability
6、計算機輔助設計：computer-aideddesign.(CAD)
7、計算機輔助製造：computer-aidedmanufacturing.(CAM)
8、計算機集成製造：computerintegratmanufacturing.(CIM)
9、計算機輔助工程：computer-aidedengineering.(CAE)
10、計算機輔助測試：computer-aidedtest.(CAT)
11、電子設計自動化：electricdesignautomation.(EDA)
12、工程設計自動化：engineeringdesignautomaton.(EDA2)
13、組裝設計自動化：assemblyaidedarchitecturaldesign.(AAAD)
14、計算機輔助製圖：computeraideddrawing
15、計算機控制顯示：computercontrolleddisplay.(CCD)
16、布局：placement
17、布線：routing
18、布圖設計：layout
19、重布：rerouting
20、模擬：simulation
21、邏輯模擬：logicsimulation
22、電路模擬：circitsimulation
23、時序模擬：timingsimulation
24、模組化：modularization
25、布線完成率：layouteffeciency
26、機器描述格式：machinedescriptionmformat.(MDF)
27、機器描述格式資料庫：MDFdatabse
28、設計資料庫：designdatabase
29、設計原點：designorigin
30、最佳化（設計）：optimization(design)
31、供設計最佳化坐標軸：predominantaxis
32、表格原點：tableorigin
33、鏡像：mirroring
34、驅動檔案：drivefile
35、中間檔案：intermediatefile
36、製造檔案：manufacturingdocumentation
37、佇列支撐資料庫：queuesupportdatabase
38、元件安置：componentpositioning
39、圖形顯示：graphicsdispaly
40、比例因子：scalingfactor
41、掃描填充：scanfilling
42、矩形填充：rectanglefilling
43、填充域：regionfilling
44、實體設計：physicaldesign
45、邏輯設計：logicdesign
46、邏輯電路：logiccircuit
47、層次設計：hierarchicaldesign
48、自頂向下設計：top-downdesign
49、自底向上設計：bottom-updesign
50、線網：net
51、數位化：digitzing
52、設計規則檢查：designrulechecking
53、走（布）線器：router(CAD)
54、網路表：netlist
55、計算機輔助電路分析：computer-aidedcircuitanalysis
56、子線網：subnet
57、目標函式：objectivefunction
58、設計後處理：postdesignprocessing(PDP)
59、互動式製圖設計：interactivedrawingdesign
60、費用矩陣：costmetrix
61、工程圖：engineeringdrawing
62、方塊框圖：blockdiagram
63、迷宮：moze
64、元件密度：componentdensity
65、巡迴售貨員問題：travelingsalesmanproblem
66、自由度：degreesfreedom
67、入度：outgoingdegree
68、出度：incomingdegree
69、曼哈頓距離：manhattondistance
70、歐幾里德距離：euclideandistance
71、網路：network
72、陣列：array
73、段：segment
74、邏輯：logic
75、邏輯設計自動化：logicdesignautomation
76、分線：separatedtime
77、分層：separatedlayer
78、定順序：definitesequence
五、形狀與尺寸：
1、導線（通道）：conduction(track)
2、導線（體）寬度：conductorwidth
3、導線距離：conductorspacing
4、導線層：conductorlayer
5、導線寬度/間距：conductorline/space
6、第一導線層：conductorlayerNo.1
7、圓形盤：roundpad
8、方形盤：squarepad
9、菱形盤：diamondpad
10、長方形焊盤：oblongpad
11、子彈形盤：bulletpad
12、淚滴盤：teardroppad
13、雪人盤：snowmanpad
14、V形盤：V-shapedpad
15、環形盤：annularpad
16、非圓形盤：non-circularpad
17、隔離盤：isolationpad
18、非功能連線盤：monfunctionalpad
19、偏置連線盤：offsetland
20、腹（背）裸盤：back-bardland
21、盤址：anchoringspaur
22、連線盤圖形：landpattern
23、連線盤格線陣列：landgridarray
24、孔環：annularring
25、元件孔：componenthole
26、安裝孔：mountinghole
27、支撐孔：supportedhole
28、非支撐孔：unsupportedhole
29、導通孔：via
30、鍍通孔：platedthroughhole(PTH)
31、余隙孔：accesshole
32、盲孔：blindvia(hole)
33、埋孔：buriedviahole
34、埋/盲孔：buried/blindvia
35、任意層內部導通孔：anylayerinnerviahole(ALIVH)
36、全部鑽孔：alldrilledhole
37、定位孔：toalinghole
38、無連線盤孔：landlesshole
39、中間孔：interstitialhole
40、無連線盤導通孔：landlessviahole
41、引導孔：pilothole
42、端接全隙孔：terminalclearomeehole
43、準表面間鍍覆孔：quasi-interfacingplated-throughhole
44、準尺寸孔：dimensionedhole
45、在連線盤中導通孔：via-in-pad
46、孔位：holelocation
47、孔密度：holedensity
48、孔圖：holepattern
49、鑽孔圖：drilldrawing
50、裝配圖：assemblydrawing
51、印製板組裝圖：printedboardassemblydrawing
52、參考基準：datumreference
